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In recent years the design of portable electronic devices must incorporate thermal analyses to ensure the device can be adequately cooled to acceptable temperatures. Consumer demand for smaller, more powerful devices has lead to an increase in the heat required to be dissipated and a reduction in the surface area both of which result in an increased heat flux. In this paper, an experimental study...
Thermal management of device level packaging continues to present many technical challenges. In the typical chip heat sink assembly, the highest resistance to heat flow comes from the thermal interface material (TIM). The thermal conductivities of TIMs remain in the range of 1-4 W/mK due to the properties and structure of small dispersed solids in polymer matrices. As a result of the rising design...
In this paper, we compare thermal performances of two-types of heat sinks commonly used in the electronic equipment industry: plate-fin and pin-fin heat sinks. In particular, heat sinks subject to an impinging flow are considered. For comparison of the heat sinks, we suggest a model based on the averaging method for predicting the pressure drop and the thermal resistance. Experimental investigations...
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