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In natural convection applications, the components used for cooling may represent a significant portion of the overall weight of the system. Consequently, advanced materials are of interest in such applications, as they may substantially reduce the total size and the weight of the system. Many of these advanced materials have anisotropic thermo physical properties, hence the control of thermal conductivity...
Design features and experimental results are presented for a heatsink with the thermo-siphon structure for cooling multi- chip modules. The prototype heatsink was made, which consists of copper tubes, stainless container, PF-5060 as a coolant and rubber heaters for simulating multi-chip modules, and some basic experiments were carried out to obtain the cooling performance of the heatsink with the...
In the electronics cooling literature, the use of the overall thermal resistance to describe the thermal performance of cooling technologies, has hindered the adoption of more robust and powerful thermal performance metrics, most notably the heat exchanger effectiveness, epsiv , that arises in the theory of heat exchangers. This paper presents a theoretical treatment of the heat transfer in cold plates...
This study examines numerically details of the flow and temperature fields of heat sinks with short plate fins cooled by impinging jet. The main focus is on the effect of fin shapes on the heat sink performance. Conjugate heat transfer between airflow convection and conduction inside the fin and base is considered. Three different shapes under study are rectangular, round-headed and elliptic, while...
Thermal performance of louver fin, offset strip fin and plate fin in a thermoelectric cooling system with a duct-flow type fan arrangement is analytically examined. The thermoelectric cooling system is composed of a water jacket, an array of thermoelectric modules and a heat sink. Heat sinks with dimension of 39.7 mm times 119.1 mm plane area and 40 mm fin height are considered for the performance...
The ever-increasing size of wireless networks has led to the development of new base station architectures. Traditional telecommunication base stations have baseband and radio-frequency (RF) components mounted inside an air-conditioned hut with co-axial cables transmitting signals to remote antennas. The industry is moving to distributed network and remote radio head (RRH) architectures where the...
The effects of vortex generators (VG's) on fluid flow and heat transfer have been studied extensively in the literature. The majority of these studies have examined the effects of using VG's in heat exchanger applications. Other investigations have examined the role of placing VG's in channel flow or on a heated flat plate owing to the fact that these experimental set-ups facilitate easy comparison...
In this paper, a novel heat sink with moving fins inserted between cooling fins is suggested for electronics cooling applications. In the novel heat sink, instead of the fan module, moving fins are inserted in the intervals of fixed fins (cooling fins) for generating fluid flow. By the relative motion of the moving fins to the cooling fins, heat dissipation from the cooling fins to the coolant and...
Recent developments in thermoelectric materials have led to renewed interest in thermoelectric devices for power generation. In a system where a thermoelectric generator uses a finite heat source and sink such as fluid streams, thermodynamic characteristics of the heat source and heat sink are relevant in evaluating the conversion efficiency. Based on the system efficiency equations derived in prior...
In a typical power electronics package, a grease layer forms the interface between the direct bond copper (DBC) layer or a baseplate and the heat sink. This grease layer has the highest thermal resistance of any layer in the package. Reducing the thermal resistance of this thermal interface material (TIM) can help achieve the FreedomCAR program goals of using a glycol water mixture at 105degC or even...
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