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Rapid development in the design of electronic packages for modern high-speed computers has led to the demand for effective methods of chip cooling. The primary concerns in thermal management applications are high thermal conductivity, large specific surface area and low weight. Graphite foams which possess predominantly spherical pores with smaller openings between the cells constitute a novel highly-conductive...
Nano fluids are colloidal solutions which contain a small volume fraction of suspended submicron particles or fibers in heat transfer liquids, such as water or glycol mixtures. Compared with the base fluid, numerous experiments have generally indicated an increase in effective thermal conductivity and a strong temperature dependence of the static effective thermal conductivity. However, in practical...
In high power electronics applications, the most preferred way of thermal management is the use of a heat sink and a fan for active cooling. Though this thermal solution is fairly adequate for the current heat dissipation needs, it suffers from some serious limitations, which may tend to limit its use with time. In the present study, we quantify the limitations of a conventional fan-cooled heat sink...
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