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Chip-level heat flux levels have risen beyond 250 W/cm2 due to the presence of circuit architecture-driven hot-spots. After intense scrutiny over the past two decades, microchannel heat sinks are closer to commercial implementation as evidenced by the advent of the single-chip silicon cooler announced recently by IBM. Though there are a multitude of studies and data related to multichannel configurations,...
The merits of water-fed microchannel heat sinks have shown that the technology may be a plausible and effective cooling solution for the ever-increasing power dissipation of high speed microprocessors. Favorable factors such as high heat transfer surface area and heat flux removal for reasonable operating pressures, as well small heat sink mass and volume continue to drive the technology. However,...
Many factors, such as acoustic noise limits and fan reliability considerations, limit the heat dissipation capacity of air-cooled cabinets housing telecommunications or computing hardware. The present work examines the potential of enhanced cooling in a sealed telecommunications cabinet using an evaporating- condensing dielectric mist introduced upstream of heat sinks attached to high-power components...
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