The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Rapid development in the design of electronic packages for modern high-speed computers has led to the demand for effective methods of chip cooling. The primary concerns in thermal management applications are high thermal conductivity, large specific surface area and low weight. Graphite foams which possess predominantly spherical pores with smaller openings between the cells constitute a novel highly-conductive...
A pressure atomized evaporative spray cooling nozzle array was used to thermally manage the power electronics of a 3 phase inverter module. The module tested was a COTS module manufactured by Semikron, Inc., and has a maximum DC power input of 180 kW (450 VDC and 400 A) with 25degC coolant. However, the standard heat sink that the module uses is a single phase liquid heat sink and when 100degC coolant...
In natural convection applications, the components used for cooling may represent a significant portion of the overall weight of the system. Consequently, advanced materials are of interest in such applications, as they may substantially reduce the total size and the weight of the system. Many of these advanced materials have anisotropic thermo physical properties, hence the control of thermal conductivity...
Design features and experimental results are presented for a heatsink with the thermo-siphon structure for cooling multi- chip modules. The prototype heatsink was made, which consists of copper tubes, stainless container, PF-5060 as a coolant and rubber heaters for simulating multi-chip modules, and some basic experiments were carried out to obtain the cooling performance of the heatsink with the...
In the electronics cooling literature, the use of the overall thermal resistance to describe the thermal performance of cooling technologies, has hindered the adoption of more robust and powerful thermal performance metrics, most notably the heat exchanger effectiveness, epsiv , that arises in the theory of heat exchangers. This paper presents a theoretical treatment of the heat transfer in cold plates...
In recent years the design of portable electronic devices must incorporate thermal analyses to ensure the device can be adequately cooled to acceptable temperatures. Consumer demand for smaller, more powerful devices has lead to an increase in the heat required to be dissipated and a reduction in the surface area both of which result in an increased heat flux. In this paper, an experimental study...
For a given heat sink thermal resistance and ambient temperature, the temperature of an electronic device rises fairly linearly with increasing device heat flux. This relationship is especially problematic for defense electronics, where heat dissipation is projected to exceed 1000 W/cm2 in the near future. Direct and indirect low temperature refrigeration cooling facilitate appreciable reduction in...
Thermal performance of louver fin, offset strip fin and plate fin in a thermoelectric cooling system with a duct-flow type fan arrangement is analytically examined. The thermoelectric cooling system is composed of a water jacket, an array of thermoelectric modules and a heat sink. Heat sinks with dimension of 39.7 mm times 119.1 mm plane area and 40 mm fin height are considered for the performance...
To address the thermal management challenges associated with high power dissipation devices, we describe a novel hybrid thermal management device, which enables significant enhancement of conventional air-cooled heat sinks using on- demand and spatially controlled droplet/jet impingement evaporative cooling. The device architecture modifies an air (gas)-cooled heat sink by adding a multiplexed, planar...
The merits of water-fed microchannel heat sinks have shown that the technology may be a plausible and effective cooling solution for the ever-increasing power dissipation of high speed microprocessors. Favorable factors such as high heat transfer surface area and heat flux removal for reasonable operating pressures, as well small heat sink mass and volume continue to drive the technology. However,...
In this paper, a novel heat sink with moving fins inserted between cooling fins is suggested for electronics cooling applications. In the novel heat sink, instead of the fan module, moving fins are inserted in the intervals of fixed fins (cooling fins) for generating fluid flow. By the relative motion of the moving fins to the cooling fins, heat dissipation from the cooling fins to the coolant and...
Many factors, such as acoustic noise limits and fan reliability considerations, limit the heat dissipation capacity of air-cooled cabinets housing telecommunications or computing hardware. The present work examines the potential of enhanced cooling in a sealed telecommunications cabinet using an evaporating- condensing dielectric mist introduced upstream of heat sinks attached to high-power components...
An innovative heat sink design aimed at meeting both the hotspot and large background heat flux requirements of next generation integrated circuits is presented. The heat sink design utilizes two separate, unmixed fluids to meet the cooling requirements of the chip with one fluid acting as a fluidic spreader dedicated to cooling the hotspots only, while the second fluid serves as both a coolant for...
In high power electronics applications, the most preferred way of thermal management is the use of a heat sink and a fan for active cooling. Though this thermal solution is fairly adequate for the current heat dissipation needs, it suffers from some serious limitations, which may tend to limit its use with time. In the present study, we quantify the limitations of a conventional fan-cooled heat sink...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.