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INTRODUCTION Maintaining the integrity of the heat dissipation path for high end microelectronic devices has become increasingly challenging as the industry migrates from ceramic to organic packaging. Typically, flip chip organic packages undergo significant thermal and mechanical stresses throughout the manufacturing process, including chip join, underfill, encapsulation, BGA attach and card join...
Applications that exploit the exceptional transport properties of carbon nanotubes (CNTs) at practical length scales almost invariably require good contact of the CNTs with the contacting surface. For example, vertically aligned and dense arrays of carbon nanotubes have been demonstrated to be good thermal interface materials. However, interfacial resistance to thermal and electrical transport between...
Sintered nanoscale silver paste was used as thermal interface material in an electronic package. Based on the microstructure of the sintered silver paste, die shear stress-strain curves and thermal cycling test results, a model combined with the model of Navarro-de los Rios and small cracks interaction physical model is put forward to predict the thermal fatigue lifetime of the sintered nanoscale...
Thermal management of device level packaging continues to present many technical challenges. In the typical chip heat sink assembly, the highest resistance to heat flow comes from the thermal interface material (TIM). The thermal conductivities of TIMs remain in the range of 1-4 W/mK due to the properties and structure of small dispersed solids in polymer matrices. As a result of the rising design...
There is a need for standard TIM characterization technique for notebook specific applications. The current standard method, ASTM D5470 tester neglects the usage conditions encountered in mobile specific applications. In addition, characterizing "Beginning of Life" performance of TIMs is not sufficient as performance can degrade with usage. This paper emphasizes the importance of considering...
Particle laden polymer composites are widely used as thermal interface materials (TIMs) in the electronics cooling industry. A critical need in developing TIMs is apriori modeling from first principles to predict the effect of particle volume fraction and arrangements. This in turn will help optimize the material. In general, TIM systems contain random distributions of particles of a polydisperse...
The performance of high power packages is limited in part by the interfacial resistance between the die and lid or heat sinks. The thermal resistance depends on the shape of mating surfaces, bondline thickness (BLT) of the thermal interface material (TIM), bulk thermal conductivity and contact resistance. This paper focuses on warpage modeling methods to predict the local variation of TIMs and its...
Integrating microchannels at the thermal interfaces of heat sinks, spreaders, and microprocessor chips can reduce bond line thickness, assembly pressure, and overall thermal resistance. The channels help control the flow of particle-filled thermal interface materials (TIM) during the assembly squeeze but the relationship between channel geometry, material properties, and interfacial area is not fully...
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