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This investigation is an effort to demonstrate the feasibility of confined cell design for a phase change random access memory (Ovonic Unified Memory, OUM) cell which benefits, respectively, from the low current and the simple fabrication process of a line memory cell and T- structure. Similar to OUM devices, the confined cell design is also highly scalable. The 2-D numerical simulation results of...
This paper demonstrates an approach for thermal solution development of high power memory module for computer system platforms. A lumped thermal resistance equation is adopted to consider the coupling between register/buffer and DRAMs. Comprehensive thermal analysis is done to characterize the thermal resistances under various memory thermal conditions in different system configurations. Memory thermal...
In recent years the design of portable electronic devices must incorporate thermal analyses to ensure the device can be adequately cooled to acceptable temperatures. Consumer demand for smaller, more powerful devices has lead to an increase in the heat required to be dissipated and a reduction in the surface area both of which result in an increased heat flux. In this paper, an experimental study...
Shrinking chip feature sizes and increasing performance demands are resulting in non-uniform on-chip power dissipation. Sub-millimeter regions of high heat flux are developing with heat fluxes exceeding the average chip flux by a factor of six to ten and peak heat fluxes approaching 1000 W/cm2. These "flux-spots" can yield locally high temperatures ("hotspots") and extreme thermal...
A multi-scale modeling approach is proposed and employed to investigate thermal issues and to enable "thermally aware" design of radio-frequency (RF) integrated circuits (ICs). Thermal analysis from full-chip scale down to the single transistor level was made possible with the development of this approach using the finite volume three-dimensional (3D) numerical technique. We have developed...
Thermal management of device level packaging continues to present many technical challenges. In the typical chip heat sink assembly, the highest resistance to heat flow comes from the thermal interface material (TIM). The thermal conductivities of TIMs remain in the range of 1-4 W/mK due to the properties and structure of small dispersed solids in polymer matrices. As a result of the rising design...
Spatial frequency domain (SFD) analyses of heat transfer along with the spatially-resolved imaging of microprocessor power (SIMP) method have provided a deeper understanding of the thermal behavior of microprocessors. In the present work, the thermal transfer function of a convectively cooled chip is written as a summation of functions with known Hankel transform pairs. Subsequently, the impulse response...
A detailed transient thermal study for a Remote Keyless Entry System with dynamic heat sources is performed using numerical simulations. The device is packaged in a 54 lead SOIC (small outline IC) package with an exposed copper slug, attached to a 4-layer PCB with thermal vias embedded in the board. The challenge resides in the transient thermal interaction between the several dynamic heat sources...
The power dissipated by electronic components has been steadily increasing, but financial and form factor restrictions exist on the cooling solution and the pressure is on to improve the power dissipation capability. The main parameter used for designing a component's cooling system is known as Thermal Design Power (TDP). This parameter is used as a steady state power target that the cooling solution...
Non-uniform temperature profile generated by hot- spots affect the nearby units in a chip. Different sections of a large sized cache memory would experience different failure statistics due to their proximity to the hot-spots. The nano-scaled SRAM (Static Random Access Memory) cell stability is analyzed systematically under such 'spatial' temperature variations for different technologies. The bitcell...
In this paper, we compare thermal performances of two-types of heat sinks commonly used in the electronic equipment industry: plate-fin and pin-fin heat sinks. In particular, heat sinks subject to an impinging flow are considered. For comparison of the heat sinks, we suggest a model based on the averaging method for predicting the pressure drop and the thermal resistance. Experimental investigations...
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