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The effective thermal conductivity of non-continuum wires with rough boundaries was investigated theoretically. The boundaries were designed to reflect phonons differently depending on the phonon frequency or the angle of incidence. Devices with these properties could be useful in thermal management problems on the nanoscale and microscale. In the first study the scattering was dependent on the frequency...
In recent years, a variety of models based on phonon Boltzmann transport (BTE) has been developed to model sub-micron heat conduction. A recent BTE model, called the full-scattering model, was developed incorporating direct calculation of three-phonon scattering terms. Though this model accurately represents resistive processes, it is computationally very expensive. In this paper, a new BTE model...
Detailed phonon transport at a rough semiconductor interface is studied by the molecular dynamics method. The simulation results show that phonon transmission coefficient is a strong function of frequency, roughness characteristic length and atomic structure. When the roughness characteristic length is comparable to the phonon wave length, the phonon transmission is decreased significantly. Complex...
Minimizing the thermal resistance of thermal interface material (TIM) bondlines is of interest to the electronics industry. The thermal interface material class examined in this study comprises epoxy based adhesives in which conductive filler particles are suspended. When used to assemble a thin bondline (on the order of two hundred microns or less) the apparent thermal conductivity of the bondline...
Heat transfer modeling in electronic devices has gained importance over the last decade in the design of better performing devices. The trend towards miniaturization of these devices has led to components that operate in the micro and nano-meter and in the micro and pico-second ranges. When the characteristic dimensions of the electronic components are comparable to or smaller than the mean free path...
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