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In this paper we describe a novel cooling scheme utilizing a combination of fluidic (single-phase convection and phase change) and solid-state (superlattice cooler) techniques to simultaneously remove high background heat fluxes (~100 W/cm2) over the entire chip and dissipate ultra high heat fluxes (~0.5-1 kW/cm2) from multiple localized hotspots. This paper focuses on the conceptual design to assess...
For a given heat sink thermal resistance and ambient temperature, the temperature of an electronic device rises fairly linearly with increasing device heat flux. This relationship is especially problematic for defense electronics, where heat dissipation is projected to exceed 1000 W/cm2 in the near future. Direct and indirect low temperature refrigeration cooling facilitate appreciable reduction in...
The merits of water-fed microchannel heat sinks have shown that the technology may be a plausible and effective cooling solution for the ever-increasing power dissipation of high speed microprocessors. Favorable factors such as high heat transfer surface area and heat flux removal for reasonable operating pressures, as well small heat sink mass and volume continue to drive the technology. However,...
Boiling in microchannel heat sinks is attractive for high-performance electronics cooling due to the high heat transfer rates that can be achieved. However, the physics of flow boiling in microchannels, the flow patterns present, and the effect of microchannel size on the boiling regimes have not been investigated extensively, particularly with dielectric fluids. In the present work, experiments are...
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