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Design features and experimental results are presented for a heatsink with the thermo-siphon structure for cooling multi- chip modules. The prototype heatsink was made, which consists of copper tubes, stainless container, PF-5060 as a coolant and rubber heaters for simulating multi-chip modules, and some basic experiments were carried out to obtain the cooling performance of the heatsink with the...
Boiling heat transfer enhancement for a two-phase cooling design is presented in this paper. The paper discusses an effective method of boiling heat transfer enhancement and its performance. The pool boiling heat transfer from the silicon surface is enhanced by combination of surface modification and micro machined structure. The effect of micro structure features like pore diameter, pore pitch, channel...
The fast development in semiconductor technology is leading to very high chip power dissipation and greater non- uniformity of on-chip power dissipation with the result of localized hot spots, often exceeding lkW/cm2 in heat flux, which can degrade the microelectronics performance and reliability. Thin and very thin liquid films driven by a forced gas/vapor flow (stratified or annular flows), i.e...
Data center facilities house large number of computer servers that dissipate high power. With rapid increase in the heat flux of such systems, their thermal management has become a challenge that needs to be addressed. In this paper effect of isolating cold aisle on rack inlet temperature is studied computationally. Two raised floor data center configurations with alternating hot and cold aisle arrangement...
A tube-type evaporator requires capillary force in order to lift liquid refrigerant to circumference direction under a gravity field, which reduces thermal performance. Therefore, a capillary pumped loop with a plate-type evaporator was newly manufactured to improve the performance and reduce the thickness of the evaporator. The plate-type evaporator is flat disk shaped with an effective diameter...
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