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With the proliferation of mobile electronics in everyday life, the ability of electronic packages to sustain impact loading under drop conditions has become a paramount reliability concern. Since solder joints, which serve as mechanical and electrical interconnects in a package, are particularly prone to failure during a drop, the fracture behavior of solders at high strain rates is a critically important...
The mechanical properties of electronic solder materials are highly dependent on test temperature and strain rate. In this paper strain rate dependent elastic modulus and yield strength of Sn-3.8Ag-0.7Cu and Sn-Ag-Cu-X (SAC-X) where, X is a small addition of a fourth element. Nano-indentation tests were conducted from slow to intermediate strain rates, (10-3 ~101) by using the continuous stiffness...
Predicting reliability of solder joints requires a thorough understanding of solder constitutive behavior. Recent studies on SnAgCu solder alloys have reported that pre-test conditions of aging-time and aging-temperatures can be factors that significantly affect solder constitutive behavior. The results presented here are a part of ongoing efforts to construct constitutive models that can predict...
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