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An experimental apparatus has been designed and constructed to accurately measure the next generation of high-performance thermal interface materials with unprecedented precision and accuracy. The apparatus is based on a common implementation of ASTM D5470 using meter bars. However, the apparatus in the present study is unique in that it utilizes small thermistors to make precise thermal measurements...
There is a need for standard TIM characterization technique for notebook specific applications. The current standard method, ASTM D5470 tester neglects the usage conditions encountered in mobile specific applications. In addition, characterizing "Beginning of Life" performance of TIMs is not sufficient as performance can degrade with usage. This paper emphasizes the importance of considering...
In a typical power electronics package, a grease layer forms the interface between the direct bond copper (DBC) layer or a baseplate and the heat sink. This grease layer has the highest thermal resistance of any layer in the package. Reducing the thermal resistance of this thermal interface material (TIM) can help achieve the FreedomCAR program goals of using a glycol water mixture at 105degC or even...
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