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With the proliferation of mobile electronics in everyday life, the ability of electronic packages to sustain impact loading under drop conditions has become a paramount reliability concern. Since solder joints, which serve as mechanical and electrical interconnects in a package, are particularly prone to failure during a drop, the fracture behavior of solders at high strain rates is a critically important...
Microelectronic encapsulants exhibit evolving properties that change significantly with environmental exposures such as isothermal aging and thermal cycling. Such aging effects are exacerbated at higher temperatures typical of thermal cycling qualification tests for harsh environment electronic packaging. In this work, the material behavior changes occurring in flip chip underfill encapsulants (silica...
Predicting reliability of solder joints requires a thorough understanding of solder constitutive behavior. Recent studies on SnAgCu solder alloys have reported that pre-test conditions of aging-time and aging-temperatures can be factors that significantly affect solder constitutive behavior. The results presented here are a part of ongoing efforts to construct constitutive models that can predict...
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