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Electronic assemblies may often be approximated as layered structures during their analysis. Therefore, the thermal stresses that develop in bonded layers is of interest in the modeling of reliability of electronic assemblies. At the present time, analytical models of thermal stresses in multilayered assembly, inspired by the classical work of Timoshenko, exist in the literature. The current approaches...
INTRODUCTION Maintaining the integrity of the heat dissipation path for high end microelectronic devices has become increasingly challenging as the industry migrates from ceramic to organic packaging. Typically, flip chip organic packages undergo significant thermal and mechanical stresses throughout the manufacturing process, including chip join, underfill, encapsulation, BGA attach and card join...
To meet electrical performance requirements, the industry is implementing ultra-low dielectric constant (ULK) materials in the back end of line interconnect structure. ULK dielectrics are inherently weak compared to traditional dielectrics and pose significant challenges to electronic packaging processes and reliability. Accurate mechanical properties are a prerequisite for upfront risk assessments...
There is a need for standard TIM characterization technique for notebook specific applications. The current standard method, ASTM D5470 tester neglects the usage conditions encountered in mobile specific applications. In addition, characterizing "Beginning of Life" performance of TIMs is not sufficient as performance can degrade with usage. This paper emphasizes the importance of considering...
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