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In natural convection applications, the components used for cooling may represent a significant portion of the overall weight of the system. Consequently, advanced materials are of interest in such applications, as they may substantially reduce the total size and the weight of the system. Many of these advanced materials have anisotropic thermo physical properties, hence the control of thermal conductivity...
Design features and experimental results are presented for a heatsink with the thermo-siphon structure for cooling multi- chip modules. The prototype heatsink was made, which consists of copper tubes, stainless container, PF-5060 as a coolant and rubber heaters for simulating multi-chip modules, and some basic experiments were carried out to obtain the cooling performance of the heatsink with the...
This paper describes the effects of the outlet vent size and the distance between the outlet vent location and the power heater position on the flow resistance in natural-air-cooled electronic equipment casings. An experiment was carried out using a simple model casing simulated for the practical natural-air-cooled casing which is composed of 4 side walls, a top plate and bottom plate which has an...
As portable platforms including laptops, handheld PCs, and similar handheld electronics become more powerful and more popular, they present unique thermal management challenges. In the past, most thermal management solutions have dealt with directly cooling the microprocessor by way of a heat spreader, heat sink, and fan. However, the microprocessor thermal solution does not cool all areas of the...
Very thin heat spreaders made of materials with high in-plane thermal conductivity are desirable for thermal solutions to eliminate hot spots on packages of highly converged handheld electronic devices with shrinking form factors. Graphite is used commercially in these applications because of its unique anisotropic properties of high in-plane thermal conductivity and low thru-thickness thermal conductivity...
The dimensions and power dissipation information of various commercial handheld electronics were collected to find benchmarking size and power ranges. The relationship between device size parameter, defined as total volume divided by external surface area, and the power dissipation was determined. Three dimensional finite element models were used to model the conduction, natural convection, and surface-to-surface...
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