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We have successfully fabricated a 0.5 nm FUSI-NiSi/ HfO2 HfSiOx/ Si gate stack structure with the gate-first process. The HfSiOx interfacial layer was formed by the cycle-by-cycle deposition and annealing process, followed by the in-situ layer-by-layer deposition and annealing for HfO2 growth. The gate leakage current of ~ 10 A/cm at Vfb - 1.0 V and the effective electron mobilityof 120 cm2/Vs at...
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