Semiconductor power modules are widely used in machine drive applications. The temperature distribution in the power module is the result of load properties and the drive cooling. The temperature induced thermal-mechanical stress in the power module bond wires is critical for the power module reliability and lifetime. In this paper, a two level, three phase Silicon-Carbide (SiC) inverter power module is used to drive an induction machine. The temperature distribution in the power module is evaluated under different load properties. The thermal-mechanical stress in the bond wires is investigated based on the measured/simulated power module temperature distribution. The effect of the load properties on the thermal-mechanical stress in the bond wires is studied.