The changeover from eutectic Sn-Pb solders to lead-free solders has been driven by environmental concerns and market accessibility in the last few years. Moreover, characterization of solder alloys is of primary importance for manufacturers due to their wide use as interconnects in electronic devices. There are many tests used to identify the material parameters of the solder alloys. Most often, the traditional extensometer technique is used to measure the tensile strain between two points, which provides average strain along a direction. However, it is difficult to find the strain information at occurrence of necking and the results measured from an extensometer may not be accurate. This paper focuses on a non-contact technique, namely Digital Image Correlation, to investigate the full-field strain and displacement fields during a test.