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The rising demands of miniaturize and high performance electronic gadgets necessitates higher density with higher bandwidth interconnect which is being limited by prevailing microwave effects as signaling data-rate surges and routing pitch shrinks. This paper presents a transmission line design with three-dimentional (3D) reference plane to alleviate the signaling crosstalk impacts that limit the performance scaling of high-speed parallel bus design such as on-package interconnects (OPI). Simulation result indicates eye opening improvements of >40% for OPI bus operates at 4Gbps data rate is feasibible with the crosstalk reduction achieved through the 3D reference plane design.