We present the design and fabrication of 1D capacitive micromachined ultrasonic transducer (CMUT) arrays optimized for imaging using multiple modalities. A new variation of the fabrication process based on a thick buried oxide layer is used to build these CMUTs. In our process, the via connections for each cell's electrode with the handle layer are made from the front side. This enables fabricating CMUT cells with smaller sizes, and higher resonant frequencies. Initial characterization results agree well with our design simulations.