It is widely accepted that wire bonding is the predominant method for the area of microelectronic packaging. Currently, copper wire has been studied to substitute the gold and aluminum ones in this process owing to its several advantages. However, the nanoscale interfacial characteristics of thermo sonic copper ball bonding on aluminum metallization should be carefully investigated. In this paper, a serious of examination is designed to find the IMC generates in the beginning of the electronic packaging process in two different kinds of temperature. Then, the data and results in the experiment are demonstrated in detail. Finally, some conclusions concerning the experiment are drawn from the previous work.