This paper reports on the development and characterization of a novel stress and temperature mapping chip fabricated in a standard 0.6 ??m CMOS process. The sensing array consists of 10 ?? 10 square unit cells enabling the simultaneous measurement of the absolute temperature as well as five independent mechanical stress components in a temperature compensated manner. These components are (i) the difference of in-plane normal stresses ??xx - ??yy , (ii) the in-plane shear stress sxy , (iii, iv) the out-of-plane shear stress components ??xz and ??yz and (v) the linear combination of the three normal stress components ???? = (??xx + ??yy)/2 - ?? ??zz. As application examples, stress distributions generated by applying a local force and an inhomogeneous temperature distribution across the chip were mapped.