In this paper, a system-in-package (SiP) integration solution for GSM/EDGE consisting of two monolithic integrated dies is presented. The first die includes the BB and RF transceiver blocks and is fabricated in a standard 6M 0.13 mum CMOS technology with MIM capacitors. The second die includes the PMU and an audio power amplifier and is implemented in a 0.25 mum CMOS technology. Both dies are flip-chipped side-by-side into a 10x10 mm2 very thin BGA-293 package with a dual metal layer substrate for routing.