This paper presents an alternate way of making elastomer transistor stamps and high-mobility organic field-effect transistors. In particular, the authors have removed the need to prepare and use a silanised Si wafer for curing the stamps, and the need to handle a fragile micron-thickness polydimethylsiloxane (PDMS) film and laminate it, bubble free, against the PDMS transistor stamp. The authors find that despite the altered design, rougher PDMS surface, and lamination and measurement in air, still achieve mobilities of order 10 cm2/Vs. The device shows hole conduction with a threshold voltage of -9.1 V. This corresponds to a doping concentration of 1.4 1010 cm-2, likely due to gaseous species such as oxygen adsorbed at the rubrene/PDMS interface.