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An algorithm suitable for the computer aided analysis of geometrical and resistive discontinuities present in microstrip interconnections on silicon integrated circuit subtrates is presented. The distortion and dispersion of an electrical pulse caused by such discontinuities as it propagates along the microstrip interconnect is investigated in detail. Studies carried out to assess the advantages of using superconducting tracks for the interconnections in integrated circuits in the presence of modal dispersion and geometry dependent discontinuities are also presented. The numerical results are demonstrated on realistic microstrip models for the interconnects with common type discontinuities which are selected from a practical VLSI prototype.