The purpose of this study is to fabricate copper nanowires embedded in parylene/polyimide and measure the electrical resistivity. The patterns of copper nanowires were defined by electron beam lithography on amorphous-silicon. Then copper nanowires formed by replacement method in mixture solution of cupric sulfate (CuSO4 middot 5H4 O) with HF. After the fabrication of copper, the electrical characteristic by conductive AFM was measured. The use nanoimprint-hot-embossing method was successfully to transfer these copper nanowires onto parylene/polyimide substrate