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PdSn4 is the major reaction phase in the Sn-based or Sn–Ag–Cu solder joints with Pd substrate and it exhibits an extremely high growth rate. Ga is considered as a candidate alloying element in the Sn–Ag–Cu solders. This paper investigates the effects of Ga addition on the interfacial reactions between Pd and Sn–Ga (0.1wt.%–1wt.%Ga) solders by solid-state aging at 160, 180, and 200 °C and liquid-state...
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