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The impact of copper (Cu) contamination on the minority carrier lifetime degradation of the last solidified fraction of ann-type Czochralski (CZ) silicon ingot was investigated. Lifetime degradation of more than 50% was measured at the top of an as-cut block during the first 2000h (∼83 days). Depth profiles of Cu concentration were collected over a depth of 20μm from the surface and an exponential...
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