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We discussed a method for cutting smoothly polished single-crystal silicon surfaces by wire electrical discharge machining to obtain a high-quality surface. To cut out parts with smooth surfaces from the plates by rough-cutting in water while maintaining the initial smoothness of the surfaces, several kinds of masks were applied to the polished surfaces before cutting. It was found that although the...
We investigate the effect of cutting by wire electrical discharge machining (WEDM) on the shape accuracy of polished single-crystal silicon. Single-crystal silicon plates are polished, and then contoured in deionized water or in oil by WEDM. The shape accuracy of the polished surfaces is measured with an interferometer. As a result, the polished surfaces are deformed into convex shapes by WEDM cutting...
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