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The magnitudes of input power and scan speed of laser heat source can affect the morphology and size of interfacial Cu6Sn5 intermetallic compound (IMC) formed or grown in Sn/Cu and Sn-3.5Ag-0.5Cu/Cu (SAC/Cu) joints. Experimentally, it has been observed that greater power and smaller scan speed can create temperature field of higher magnitude, thereby enhancing the interfacial reaction. The occurrence...
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