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High temperature Bi10Ag solders with different amounts of Cu were used to investigate the impacts of Cu on the microstructures, melting characteristics, wettability and shear strength of the Bi-10Ag-xCu (x=0, 0.5, 1, and 2wt%) solders. A metastable Cu-rich phase was formed due to the addition of Cu. The Cu has negligible effect on the solidus but it can decrease about 6°C on the liquidus. Doped with...
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