The present study investigated transient liquid phase (TLP) bonding of alumina (Al2O3) ceramics. Bismuth oxide, due to its low melting point was selected as filler for joining alumina to alumina using Transient Liquid Phase (TLP) method. For this purpose a thin layer of bismuth oxide was placed as an interlayer between the ceramic bodies. The growth of interfacial compounds between Al2O3 and Bi2O3 during transient liquid phase bonding at 880°C for various times was investigated. The mechanical properties of the joined samples were measured using shear testing method. To investigate the microstructure of the joining area, the cross section of the joints were studied using field emission scanning electron microscope (FESEM) and X-ray diffraction method. The results showed that longer joining times results in higher mechanical properties of the joints.