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The tensile properties of Sn-3.5mass%Ag, Sn-3.5mass%Ag-0.75mass%Cu and Sn-3mass%Ag-2mass%Bi lead-free solders were investigated and compared with those of a Sn-Pb eutectic solder. The tensile strength of each solder decreases with decreasing strain rate, and with increasing test temperature. The ductility of each lead-free solder is relatively constant in the strain rate ranging from 1.67x10 -...
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