The p-type Te doped Bi 0 . 5 Sb 1 . 5 Te 3 compounds were fabricated by powder extrusion in the temperature range 340-460 o C. The Seebeck coefficient, electrical resistivity and thermal conductivity were measured as a function of extrusion temperature to calculate the figure of merit. The highest bending strength (61.2 MPa) and the highest figure of merit (2.78x10 - 3 K - 1 ) were obtained at 420 o C because of a low porosity and fine grain size. It is proposed that a noble, new powder extrusion process, for the fabrication of high-performance Bi 2 Te 3 -based thermoelectric materials, be a useful technique.