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The low-cycle strain–life characteristic of solder joint formed by reflowing Sn1.0Ag0.1Cu solder onto copper pad has been investigated at the high cyclic frequency regime between 30Hz and 150Hz. Expressing the strain–frequency-life relation of the solder joint as εpcbfq=moNαλ, the frequency exponent q has been evaluated to be 0.34, implying decreasing fatigue life with increasing cyclic frequency,...
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