Microstructure and microtexture evolution during dynamic recrystallization (DRX) was investigated in compression of polycrystalline copper in the temperature range from 473 K to 723 K and at strain rates from 10 - 3 s - 1 to 10 - 1 s - 1 . A compression texture of near <101> direction, evolved by low temperature deformation, is gradually weakened and randomized by the progress of DRX at higher temperature, where <101> component still exists. New DRX grains are evolved by the operation of bulging of serrated grain boundaries, which is accompanied either by rotation of a bulged portion or twinning at the back of the migrating boundary. The mechanisms of dynamic nucleation and necklace DRX are discussed.