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This study presents a process for wafer handling and robust assembly, which is a novel pre-molding technology applied to assembled stacked modules prior to chip thinning. These steps aim to overcome severe challenges of achieving extra-thin thickness as low as 10μm for chip stacking in 3D-IC module, such as mechanical damage that appears during chip grinding. A packaging vehicle is fabricated to demonstrate...
To resolve and simplify the critical assembly issue regarding the interposer of 3D integrated circuits (3D-ICs), a prototype of an embedded interposer carrier (EIC) is developed and demonstrated. However, the serious warping induced during the laminating process of multi-stacked organic films needs to be resolved to achieve good co-planarity of the EIC assembled by either dies or a printed circuit...
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