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This study successfully integrated flexible silk textiles and highly conductive platinum together by a supercritical CO2-assisted electroless plating process to achieve the materials for wearable medical devices. Pt and silk textiles were chosen for the composite material due to the request of high biocompatibility in the applications. Supercritical CO2 was introduced to the catalyzation step in the...
Cu pillar bumps were mechanically enhanced using electroless Ni plating for fine-pitch electronic packaging applications. The interfacial reaction and mechanical properties of the Ni-plated Cu pillar bump joints were evaluated. After reflowing, the plated Ni layer dissolved into the Sn-Ag solder caps. The Ni was incorporated into the interfacial reactions, forming a (Cu,Ni)6Sn5 intermetallic compound...
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