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Since voids and seams are easily formed during the process of filling TSVs with high aspect ratio, good methods that can achieve the superfilling of TSVs are eagerly needed. This paper presents the numerical modeling of TSV filling concerning the influence of three additives (accelerator, suppressor and leveler). By changing the additives' doses and current density, the following three different simulation...
In this paper, the influential factors of the silent and ultrasonic electroplating using 3-mercapto-1-propanesulfonate (MPS), polyethylene glycol (PEG), and Polyethylenimine alkyl salt (PN) on the TSV filling are investigated. The effects of different accelerator concentration, current density and ultrasonic agitation on TSV filling are studied. The accelerative effect of MPS on TSV filling by the...
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