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3D sequential integration, such as CoolCube™, allows to stack vertically layer of devices. Levels of interconnection, also called intermediate Back-End-Of-Line, are needed between successive layers of transistors to avoid routing congestion. Thus, thermal stability of the dielectrics must be studied in order to fulfil the CoolCube™ requirement: at least to be stable up to 500°C during 2h. Consequently,...
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