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3D technology (TSVs, RDL, copper pillars) is gaining more and more interest. The functionalities and performances of the Wide I/O prototype (memory on logic 3D IC), developed by ST, ST-Ericson and CEA-LETI, was fully demonstrated. 3D process is mature enough to address next applications such as radiofrequency, analogic, and photonics. Nevertheless new challenges appear when 3D technology and these...
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