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Ni0.5Ti0.5NbO4 was firstly reported as filler to adjust dielectric properties of polymer matrix composites for printed circuit board (PCB) application. In this study, the Ni0.5Ti0.5NbO4 filler was modified using γ-aminopropyl triethoxy silane (KH550). The effects of KH550 on particle lipophilicity and Bisphenol-A cyanate ester resin (BADCy) curing behavior were studied. BADCy/Ni0.5Ti0.5NbO4 composites...
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