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The diffusion bonding of TC21 titanium alloy with initial grain size of 2 μm was performed at 780-980 °C for 5-90 min. The microstructure, bonding quality, microhardness and deformation ratio of the joints were analyzed. It is found that the interface bonding ratio can achieve 100% and the deformation ratio can be controlled within 10% when diffusion bonding is performed at 880 °C for 15-30 min. The...
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