Three-dimensional (3D) UV microforming delivers promising results for advanced surface micromachining. This low-cost technology, a combination of UV patterning of very thick photoresist layers and moulding of the resulting patterns by electrodeposition, opens a wide range of applications. It allows the use of materials with interesting properties that could not be provided by standard processes. Furthermore, this method can be carried out directly on pre-processed chips. The practical application of the technology is demonstrated by planar and 3D microcoils.