The impact of biaxial stress on gate leakage is investigated on fully-depleted silicon-on-insulator (FD-SOI) nMOS transistors, integrating either a standard gate stack or an advanced high-κ/metal gate stack. It is demonstrated that strained devices exhibit significantly reduced leakage currents (up to −90% at E ox =11MV/cm for σ tensile =2.5GPa). This specific effect is used to extract the conduction band offset ΔEc induced by strain and is shown to be accurate enough to monitor stress in MOSFETs. This new technique is much less sensitive to gate oxide defects than the method based on the threshold voltage shift ΔV T . This accurate experimental extraction allowed us to pick out realistic values for the deformation potentials in silicon (Ξ u =8.5eV and Ξ d =−5.2eV), among the published values.