Room temperature fracture toughness was measured for YCu, DyCu, and YAg. Standard tensile tests indicated that YCu was the least ductile of these three intermetallics (11% elongation at failure); DyCu had an intermediate ductility (16% elongation at failure); while YAg was the most ductile (20% elongation at failure). The K IC value was determined directly for YCu using ASTM test method E 399-90; J IC values were measured using ASTM test method E 813-89 for DyCu and YAg, and these J IC values were converted to K IC values. The K IC values were found to be 12.0MPam for YCu, 25.5MPam for DyCu, and 19.1MPam for YAg. These values are relatively high for polycrystalline, fully ordered, stoichiometric intermetallic compounds tested in room air of normal humidity. Factors that may contribute to the high fracture toughness of these materials are discussed.