Ag/Ni clad tape was successfully prepared by a diffusion and deformation process and used as a cost-effective substrate for the fabrication of Bi-2212 tape. The clad tape has extremely good adhesion between Ag and Ni layers. Bi-2212 powder precursor mixed with organic binder was mounted on the clad tape and subjected to a heat treatment of melting and solidification. After the heat treatment, a Bi-2212 layer with good grain alignment was produced on the Ag layer. J c for oxide exceeds 10 5 A/cm 2 at 4.2 K and 10 T, which is comparable to those of conventional Bi-2212 superconductors processed by using Ag sheath and Ag substrate.