The thermal shock behavior of 30wt%BAS/Si 3 N 4 composite was evaluated by the water-quenching technique. The results show that the investigated composite possesses excellent thermal shock resistance. The critical temperature difference (ΔT c ) of the composite is over 1100°C and the retained strength at a quenching-temperature difference of 1100°C is hardly affected by the quenching cycles. It is attributed to its high strength and low Young's modulus. The in situ growth of elongated β-Si 3 N 4 grains are also beneficial to the improvement of thermal shock resistance due to the increased crack propagation resistance by crack deflection and grain pull-out mechanisms. In addition, the formation of an oxide layer on the sample surface before quenching may act as an additional thermal barrier and leads to a reduction in the intensity of thermal shock.