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In this paper the solder balling, wetting, spreading, slumping and microhardness testing of the Sn–Zn based solders have been compared with the Sn–Pb solder. Two types of solders (Sn–9Zn and Sn–8Zn–3Bi) have been investigated along with Sn–37Pb solder for reference. The variation of these tests has been done as a function of reflow temperature from 220–250°C. Solder balls of these three solder pastes...
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