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The most effective way to increase the reliability of wire bonds in IGBT modules is reduction of temperature difference between the aluminum wires and the device. However, this lowers the power handling capability of the modules. In this paper, we show that the configuration of aluminum wire bonds on power devices has a considerable effect on the temperature distribution of the device, and that the...
In this paper, we propose a method for speeding-up Digital Signal Processing applications by partitioning them between the reconfigurable hardware blocks of different granularity and mapping critical parts of applications on coarse-grain reconfigurable hardware. The reconfigurable hardware blocks are embedded in a heterogeneous reconfigurable system architecture. The fine-grain part is implemented...
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